wafer.space Community - Non-standard Layout Wirebonding

Does anyone have experience with going through another service to do wirebonding? Wondering what the process and cost looks like.

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@stuart offers such a service (and is the person who also does the wafer.space and Tiny Tapeout stuff).

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Hi @glaxus do you have a non-standard PCB, non-standard die/padframe or both? Happy to discuss what you're looking for and if I can help

I don't have my design quite yet, was more so curious what that process looks like and if there's a big difference in cost

glaxus

Does anyone have experience with going through another service to do wirebonding? Wondering what the process and cost looks like.

Universities often have wire bonders, and will usually publish or tell you their rates for using the tool and for paying them to do work for you on said tool

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Maybe @stuart could share a standing quote that would be for the w.s. COB offering if it was a one-off custom job, so people like @glaxus can somewhat understand what it's up?

Yeah, I'm also kind of curious. Also how much it scales with number of dies to bond. I'm quite sure a lot of people could do without having the full 1000 dies bonded.

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Gets quickly hard to manage if people want extra dies bonded out tho. Like, aftewards. (edited)

@stuart Do you have an order-of-magnitude estimate for a COB-style packaging for slightly larger number of pads (say a maximum of 80 vs. the current 72 for a 1x0.5 slot) with two power rails (core 3V3, I/O 5V)? (the ultimate goal would be to then use a COB-to-DIP64 adapter using a small PCB with a 5V=>3V3 power circuit to be pin-compatible to the original DIP64 5V design).